Etching is a critical step in the production of Flexible PCBs (FPCs). This page explains the types, process, key technical considerations, and precautions related to etching in FPC manufacturing.
Etching is a process that removes specific surface areas from materials like printed circuit boards, semiconductors, metals, and glass to create desired patterns or structures. Compared to cutting or grinding, etching allows for the removal of extremely fine layers, making it ideal for precision surface processing.
The typical etching process involves applying a durable, corrosion-resistant resist material to mask areas that should remain untouched. The unmasked areas are then exposed to chemicals or ion beams to be removed. After the unwanted material is etched away, the resist is stripped, revealing the final structure or shape.
There are two main surface treatment methods used in etching: chemical corrosion and ion beam exposure.
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Wet etching uses chemical corrosion to dissolve unwanted materials. It is highly cost-effective and suitable for mass production. This method is not only common in PCB manufacturing but also used in decorative glass processing, copperplate artwork, and as a supplementary process in semiconductor fabrication.
Dry etching removes materials using ion beams or reactive gases. It is mainly used in processing semiconductors and MEMS (Micro-Electro-Mechanical Systems). While it allows for finer detail than wet etching, it is also more expensive.
In isotropic etching, the etching reaction proceeds evenly in all directions. This occurs when the reaction speed is fast. As a result, the edges of the etched areas tend to become rounded, forming a U-shaped profile.
Anisotropic etching proceeds in a specific direction only and occurs when the reaction is slower. This method preserves sharper corners and avoids undercutting near the resist. Although anisotropic etching is often preferred for precision, its lower reaction speed can reduce productivity—making the balance between quality and efficiency a key know-how in the etching process.
Chemical etching utilizes corrosive chemicals to create patterns, openings, or surface textures. It allows batch processing, making it more cost-efficient than mechanical drilling or laser cutting. It also produces clean finishes without burrs or debris.
However, if isotropic etching occurs unintentionally, it may remove more than necessary. Therefore, precise control of reaction speed is required. Delivering optimal results demands a high level of technical expertise.
Photo etching combines photolithography with chemical etching. A photoresist is exposed to ultraviolet light through a photomask that contains the desired pattern. After development, the resist pattern is left on the substrate, which is then etched accordingly.
This method allows for extremely fine patterning and is commonly used in PCB production, including for Flexible PCBs.
Etching is a vital step in Flexible PCB manufacturing. Achieving high-quality results requires a deep understanding of the process and refined technical skills. When selecting a manufacturer, it's important to consider their expertise in etching technologies.
Choosing a manufacturer that can support everything from design to production can significantly reduce both cost and time. Below are three trusted FPC manufacturers from Japan, each with unique strengths in their respective fields.
Source: Sanyo's Official Website (http://www.wsanyo.jp/)
Source: Cir-Tech's Official Website (https://cir-tech.co.jp/)
Source: Yamaichi Electronics official website (https://www.yamaichi.co.jp/)